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12-BIT 3:1 MUX/DEMUX SWITCH
Integrated Device Technology, Inc.
IDT74FST163214 ADVANCE INFORMATION
FEATURES:
* Bus switches provide zero delay paths * Extended commercial range of -40C to +85C * Low switch on-resistance: FST163xxx - 4 * TTL-compatible input and output levels * ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) * Available in SSOP, TSSOP and TVSOP
DESCRIPTION:
The FST163214 belong to IDT's family of Bus switches. Bus switch devices perform the function of connecting or isolating two ports without providing any inherent current sink or source capability. Thus they generate little or no noise of
their own while providing a low resistance path for an external driver. These devices connect input and output ports through an n-channel FET. When the gate-to-source junction of this FET is adequately forward-biased the device conducts and the resistance between input and output ports is small. Without adequate bias on the gate-to-source junction of the FET, the FET is turned off, therefore with no VCC applied, the device has hot insertion capability. The low on-resistance and simplicity of the connection between input and output ports reduces the delay in this path to close to zero. The FST163214 provides a 12-bit TTL- compatible A port and three 12-bit TTL compatible B ports. The S0-2 pins provide mux select and disable control. The A port can be connected to any one of the three B ports by selecting appropriate S0-2 states.
FUNCTIONAL BLOCK DIAGRAM
1 of 12 Channels
1A1 1B1
PIN DESCRIPTION
Pin Names A1 B1, B2, B3 S0-2 I/O I/O I/O I Description Bus A1 Buses B1, B2, B3 Select Lines
3209 tbl 01
1B3 1B2
Flow Control S0 S1 S2
3209 drw 01
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL TEMPERATURE RANGE
(c)1996 Integrated Device Technology, Inc.
AUGUST 1996
DSC-3509/1
1
IDT74FST163214 12-BIT 3:1 MUX/DEMUX SWITCH
COMMERCIAL TEMPERATURE RANGE
PIN CONFIGURATION
S0 1A1 1B3 2A1 2B3 3A1 3B3 GND 4A1 4B3 5A1 5B3 6A1 6B3 7A1 7B3 VCC 8A1 GND 8B3 9A1 9B3 10A1 10B3 11A1 11B3 12A1 12B3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
SSOP/ TSSOP/TVSOP TOP VIEW
ABSOLUTE MAXIMUM RATINGS(1)
56 55 54 53 52 51 50 49 48 47 46 45 SI S2 1B1 1B2 2B1 2B2 3B1 GND 3B2 4B1 4B2 5B1 5B2 6B1 6B2 7B1 7B2 8B1 GND 8B2 9B1 9B2 10B1 10B2 11B1 11B2 12B1 12B2
Symbol Description VTERM(2) Terminal Voltage with Respect to GND TSTG Storage Temperature IOUT Maximum Continuous Channel Current
Max. -0.5 to +7.0 -65 to +150 128
Unit V C mA
3209 tbl 02 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condiitions for extended periods may affect reliability.
2. VCC, Control and Switch terminals.
CAPACITANCE(1)
Symbol CIN CI/O Parameter Control Input Capacitance Switch Input/Output Capacitance Switch Off Conditions(2) Typ. Unit 4
pF pF
3209 tbl 03
SO56-1 SO56-2 SO56-3
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
NOTES: 1. Capacitance is characterized but not tested 2. TA = 25C, f = 1MHz, VIN = 0V, VOUT = 0V
FUNCTION TABLE
S2 L L L L H H H H S1 L L H H L L H H S0 L H L H L H L H A1 Z B1 B2 Z Z B3 B1 B2 Function Disconnect A to B1 A to B2 Disconnect Disconnect A to B3 A to B1 A to B2
3209 tbl 04
3209 drw 02
2
IDT74FST163214 12-BIT 3:1 MUX/DEMUX SWITCH
COMMERCIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified: Commercial: TA = -40C to +85C, VCC = 5.0V 10%
Symbol VIH VIL II H II L IOZH IOZL IOS VIK RON Parameter Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Voltage High Impedance Output Current (3-State Output pins) Short Circuit Current Clamp Diode Voltage Switch On Resistance(4) VCC = Max., VO = GND(3) VCC = Min., IIN = -18mA VCC = Min. VIN = 0.0V ION = 64mA VCC = Min. VIN = 0.0V ION = 30mA VCC = Min. VIN = 2.4V ION = 15mA IOFF ICC Input/Output Power Off Leakage Quiescent Power Supply Current VCC = 0V, VIN or VO 4.5V VCC = Max., VIN = GND or VCC -- -- -- 0.1 1 3 A A
3209 tbl 05
Test Conditions(1) Guaranteed Logic HIGH for Control Inputs Guaranteed Logic LOW for Control Inputs VCC = Max. VCC = Max. VI = VCC VI = GND VO = VCC VO = GND
Min. 2.0 -- -- -- -- -- -- -- -- -- --
Typ.(2) -- -- -- -- -- -- 300 -0.7 4 4 6
Max. -- 0.8 1 1 1 1 -- -1.2 7 7 15
Unit V V A A mA V
NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 5.0V, +25C ambient. 3. Not more than one output should be tested at one time. Duration of the test should not exceed one second. 4. Measured by voltage drop between ports at indicated current through the switch.
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IDT74FST163214 12-BIT 3:1 MUX/DEMUX SWITCH
COMMERCIAL TEMPERATURE RANGE
POWER SUPPLY CHARACTERISTICS
Symbol ICC ICCD Parameter Quiescent Power Supply Current TTL Inputs HIGH Dynamic Power Supply Current(4) Test Conditions(1) VCC = Max. VIN = 3.4V(3) VCC = Max. Outputs Open Enable Pin Toggling 50% Duty Cycle VCC = Max. Outputs Open 3 Select Pins Toggling (12 Switches Toggling) fi = 10MHz 50% Duty Cycle Min. -- -- Typ.(2) 0.5 30 Max. 1.5 40 Unit mA A/ MHz/ Switch mA
VIN = VCC VIN = GND
IC
Total Power Supply Current (6)
VIN = VCC VIN = GND VIN = 3.4 VIN = GND
--
3.6
4.8
--
4.4
7.1
NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 5.0V, +25C ambient. 3. Per TTL driven input (VIN = 3.4V). All other inputs at VCC or GND. 4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations. 5. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested. 6. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC + ICC DHNT + ICCD (fiN) ICC = Quiescent Current ICC = Power Supply Current for a TTL High Input (VIN = 3.4V) DH = Duty Cycle for TTL Inputs High NT = Number of TTL Inputs at DH ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL) fi = Input Frequency N = Number of Switches Toggling at fi All currents are in milliamps and all frequencies are in megahertz.
3209 tbl 06
SWITCHING CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified: Commercial: TA =-40C to +85C, VCC = 5.0V 10%
Symbol tPLH tPHL tBX tPZH tPZL tPHZ tPLZ |QCI| |QDCI| Description Data Propagation Delay A to B, B to A(3,4) Switch Multiplex Delay S to A, B Switch Turn on Delay S to A, B Switch Turn off Delay S to A, B Charge Injection, Typical(5,7) Differential Charge Injection, Typical (6,7) Condition(1) CL = 50pF RL = 500 Min.(2) -- 1.5 1.5 1.5 -- -- Typ. -- -- -- -- 1.5 0.5 Max. 0.25 6.5 6.5 7 -- -- Unit ns ns ns ns pC
3209 tbl 07 NOTES: 1. See test circuit and waveforms. 2. Minimum limits guaranteed but not tested. 3. This parameter is guaranteed by design but not tested. 4. The bus switch contributes no propagation delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 2.5ns for 50pF load. Since this time is constant and much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay on the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. 5. Measured at switch turn off, load = 50 pF in parallel with 10 M scope probe, VIN = 0.0 volts. 6. Measured at switch turn off through bus multiplexer, (e.g.- A to B1 = >A to B2), load = 50 pF in parallel with 10 M scope probe, VIN at A = 0.0 volts. Charge injection is reduced because the injection from the turn off of the A to B1 switch is compensated by the turn on of the A to B2 switch. 7. Characterized parameter. Not 100% tested.
4
IDT74FST163214 12-BIT 3:1 MUX/DEMUX SWITCH
COMMERCIAL TEMPERATURE RANGE
TEST CIRCUITS AND WAVEFORMS TEST CIRCUITS FOR ALL OUTPUTS
V CC 500 VIN Pulse Generator RT D.U.T. 50pF CL 500 VOUT 7.0V
SWITCH POSITION
Test Open Drain Disable Low Enable Low All Other Tests Open
3209 lnk 08 DEFINITIONS: CL= Load capacitance: includes jig and probe capacitance. RT = Termination resistance: should be equal to ZOUT of the Pulse Generator.
Switch
Closed
3209 lnk 03
SET-UP, HOLD AND RELEASE TIMES
DATA INPUT TIMING INPUT ASYNCHRONOUS CONTROL PRESET CLEAR ETC. SYNCHRONOUS CONTROL PRESET CLEAR CLOCK ENABLE ETC. tSU 3V 1.5V 0V 3V 1.5V 0V 3V 1.5V 0V 3V 1.5V 0V
3209 lnk 04
PULSE WIDTH
tH
LOW-HIGH-LOW PULSE tW HIGH-LOW-HIGH PULSE
1.5V
tREM
1.5V
3209 lnk 05
tSU
tH
PROPAGATION DELAY
3V 1.5V 0V VOH 1.5V VOL 3V 1.5V 0V
3209 lnk 06
ENABLE AND DISABLE TIMES
ENABLE DISABLE 3V CONTROL INPUT tPZL OUTPUT NORMALLY LOW OUTPUT NORMALLY HIGH SWITCH CLOSED tPZH SWITCH OPEN 1.5V 0V 0V
3209 lnk 07
SAME PHASE INPUT TRANSITION tPLH OUTPUT tPLH OPPOSITE PHASE INPUT TRANSITION tPHL tPHL
tPLZ 3.5V 1.5V tPHZ 0.3V
1.5V 0V 3.5V 0.3V VOL VOH
NOTES: 1. Diagram shown for input Control Enable-LOW and input Control DisableHIGH 2. Pulse Generator for All Pulses: Rate 1.0MHz; tF 2.5ns; tR 2.5ns
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IDT74FST163214 12-BIT 3:1 MUX/DEMUX SWITCH
COMMERCIAL TEMPERATURE RANGE
ORDERING INFORMATION
IDT XX FST 16 XX Temp. Range Device Type X Package
PV PA PF
Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3)
163214
12-Bit 3:1 Mux/Demux
74
-40C to +85C
3209 drw 08
Integrated Device Technology, Inc. reserves the right to make changes to the specifications in this data sheet in order to improve design or performance and to supply the best possible product.
Integrated Device Technology, Inc.
2975 Stender Way, Santa Clara, CA 95054-3090
6
Telephone: (408) 727-6116
FAX 408-492-8674

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